Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad

Product Details
Customization: Available
Material: Organic Silicone
Application: Household, Medical, Industrial, Agricultural
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  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
  • Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
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  • Overview
  • Workshop
  • Product Description
  • Product Parameters
  • FAQ
Overview

Basic Info.

Model NO.
TSD-0001
Certification
ISO, FDA, REACH, RoHS
Thermal Conductivity
1.0-6.0 W/M.K
Hardness
10-35 Shore C
Thickness
0.2-20mm
Temperature Resistance Range
-40~+220 Degrees Celsius
Flame Retardancy
V0 UL-94
Voltage Resistance
>4.0 Kv/mm
Tensile Strength
8kg/Square Cm
Colors
Blue, White, Grey, Black, Yellow, Red, Green
Transport Package
Plastic Bag+Cardboard Box
Specification
40*40*30CM
Trademark
TSD
Origin
Shenzhen
HS Code
3824999999
Production Capacity
1500000pieces/Year

Packaging & Delivery

Package Size
40.00cm * 40.00cm * 30.00cm
Package Gross Weight
5.000kg

Product Description

 
Workshop

Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad


 
Product Description

Technical Description of Thermal Conductive Silicone Film
 
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
 
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad


     Thermal conductive silicone sheet is a flexible thermal conductive material widely used for heat dissipation in electronic devices. It is mainly used to fill the air gap between heating elements (such as CPUs, GPUs, power devices, etc.) and heat sinks, and reduce the operating temperature of equipment by efficiently conducting heat.
     Material composition:
Matrix material: Based on silicone, it has excellent flexibility and electrical insulation properties.
Functional filler: Adding high thermal conductivity particles (such as alumina, boron nitride, zinc oxide, or silicon carbide) significantly improves thermal conductivity.
    Application areas:
Heat dissipation scenarios such as consumer electronics, industrial equipment, automotive electronics, LED lighting, etc.
   Summary of Key Characteristics:
Thermal management function: efficiently fill interface gaps and eliminate air thermal resistance.
Material advantages: Flexibility to adapt to uneven surfaces, insulation to ensure circuit safety.
Performance enhancement: High thermal conductivity is achieved through ceramic/carbide fillers (specific values need to refer to technical specifications).
   Industry adaptation: covering heat dissipation needs in multiple fields such as electronic manufacturing, automobiles, new energy vehicles, industry, and lighting.



DESCRIPTION
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
    Regardless of the type of heat dissipation device used, if the sealing between the electronic components and the heat dissipation device is poor, there will be a large number of air gaps between the components that hinder heat transfer, resulting in the heat dissipation device being unable to effectively reduce the operating temperature of the electronic components.
    Product Features and Advantages
This series of thermal conductive materials has excellent thermal              Conductivity and filling properties:
    Interface filling: With its own flexibility and elasticity, it tightly fills the gaps between heating components and heat dissipation modules, metal mechanisms, and the chassis.
     Efficient heat dissipation: Quickly conduct and dissipate heat energy, significantly improving the working efficiency of components;
Extend lifespan: By optimizing heat dissipation efficiency, reducing the risk of thermal damage to equipment, and extending its service life.
⊙ Solve the problem of air thermal resistance → Improve heat dissipation efficiency.
⊙ Adapt to complex structural gaps → Ensure comprehensive contact.
⊙ Maintain stable operation of equipment → Achieve long-term reliability.




 
Product Parameters

 

Technical Data Sheet for Thermal Conductive Silicone Film
 
ITEM UNIT TSD100 TSD200 TSD300 TSD400 TSD500 TSD600 TSD700
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
ITEM UNIT TSD800 TSD900 TSD1000 TSD1100 TSD1200 TSD1300 TSD1400
Soft High Thermal Conductivity Silicone Film, Heat Dissipation Material, LED LCD Screen Heat Dissipation Silicone Gasket, CPU Thermal Conductivity Pad
 
FAQ

FAQ

Q1. Are you factory or trading company?
A: We are factory with more than 10 years' production experience.

Q2. What is the terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.

Q3. What are your terms of delivery?
A: EXW, FOB, CIF etc.

Q4. How about your delivery time?
A: 5-7 days for no need mold sample order, 20-30 days for official order.

Q5. Can you produce according to the samples?
A: Yes, we can produce by your samples or technical drawings. OEM and ODM are available.


Q6. What is your sample policy?
A: We will offer sample for free if sample value is less than 30USD.


Q7. Do you test all your goods before delivery?
A: Yes, our QC have 100% tested all products before delivery, we also have professional equipment to inspect the quality of cargo.

Q8. How many years has your factory been established?

A: 12+ years, we have experienced engineer, can provide one-stop manufacturing solution.

Q9. How do you provide after-sales service?
A: Our after-sales service team is always ready to help you solve any problems
We will solve the customer's urgent problem ASAP and then determine whose problem it is.

Q10. Can customize production?
A: Sure, we have professional engineers team to design according to your requests.

Q11. Can the product be assembled?
A: We can assemble and package simple products, and we have a spacious assembly workshop.

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